| 摘要 |
PURPOSE:To prevent a bonding wire from being deformed or cut due to a mechanical vibration or the like during a production process by a method wherein an island part of a lead frame is formed of a resin substrate such as a glass epoxy or the like and each stitch is bonded and fixed to the resin substrate. CONSTITUTION:Instead of a conventional island part, this island part is formed of an insulating resin substrate 5 such as a glass epoxy or the like; each stitch 3 is fixed to the insulating resin substrate 5. That is to say, a pellet 1 is fixed to a lead frame where the insulating resin substrate 5 such as the glass epoxy or the like and each stitch 3 have been bonded and fixed in advance; a bonding pad of the pellet 1 and each stitch are bonded by using a gold wire 4. Each stitch 3 is fixed to the resin substrate 5. By this setup, it is possible to prevent the wire from being deformed or cut due to a vibration or the like during a production process after a bonding operation. |
