| 摘要 |
The manufacturing method for multilayer PCB prevents inferior quality occured in fabrication of land hole or nounting of electronic units. The solder bridge is prevented by soldering in mounting the units, i.e. forming the chemical copper coating layer and electric copper coating layer at each hole. The circuit (1a) and the land are saperated by laminating the prepareg between an inner substrate (1) and outer substrates (3,3a).
|
