| 摘要 |
PURPOSE:To enhance the mounting density of a semiconductor device by a method wherein opposite faces of two lead frames where semiconductor elements are mounted are bonded to each other and this assembly is resin-sealed. CONSTITUTION:A semiconductor element 4 is mounted on a main face of a lead frame 1; the semiconductor element 4 is connected electrically to the lead frame 1 by using a bonding wire 3; by this setup, a first assembly is formed. A semiconductor element 4' is mounted on a main face of a lead frame 1'; it is connected electrically to the lead frame 1' by using a bonding wire 3'; by this setup, a second assembly is formed. An insulating layer 5 is situated between opposite faces of these two lead frames 1 and 2; both opposite faces are bonded to each other; after that, this assembly is sealed by using a resin 2. By this setup, a semiconductor device having two functions can be formed in one package; the mounting density of the semiconductor device can be enhanced sharply. |
