发明名称 WIRE BONDING EQUIPMENT
摘要 PURPOSE:To prevent the decrease of bondability due to attaching and depositing of scattered fine particles of a discharge electrode, by forming the discharge electrode to fuse-form a ball at the tip of a wire, by using a specified alloy. CONSTITUTION:A discharge electrode 16 to fuse-form a ball at the tip of a wire is formed by using tungsten containing yttrium or tungsten containing lanthanum. Since a copper coating film is hardly formed on the surface of the discharge electrode 16 formed by using the above alloy, the decrease of arc-start is restricted or restrained, and therefore a suitable discharging state is maintained between the discharge electrode 16 and a wire 2. As a result, a specified discharging energy is maintained, so that an adequate ball 22 is formed and excellent bondability is obtained.
申请公布号 JPH01256134(A) 申请公布日期 1989.10.12
申请号 JP19880084390 申请日期 1988.04.06
申请人 HITACHI LTD 发明人 CHUMA TOSHIO;NAKAJIMA MAKOTO;ICHIKAWA KIMINORI;OHASHI YOSHIO;KOIZUMI MASAHIRO
分类号 H01L21/60 主分类号 H01L21/60
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