Method for one-sided processing of bodies of planar extent, in particular of semiconductor wafers, and device for carrying out the method

摘要

The invention relates to a method for one-sided processing of bodies of planar extent, in particular of semiconductor wafers, as well as a device for carrying out the method. According to the invention, the body to be processed is immersed in a liquid medium, for example an etchant. In order to displace the liquid medium from the lateral surface of the body which is not to be processed, a gaseous medium is led into a narrow gap, which adjoins via the lateral surface of the body which is not to be processed, and is led over this lateral surface in such a way that the direction of flow of the gaseous medium is outwards in the radial direction from the centre of the body to the rim thereof. The result is a simple and cost-effective single-sided processing of a body, since masking of the side of the body which is not to be processed is eliminated.