| 摘要 |
PURPOSE:To improve assembling yield and mounting efficiency at the time of mounting a substrate, and to reduce a mounting cost by providing means for preventing a lead terminal from bending at its legs and effectively utilizing a space under a package. CONSTITUTION:Means for preventing the legs of a lead terminal 8 from bending in a package for containing a semiconductor integrated circuit 14 and effectively utilizing the package and the space of a printed board 10 for disposing the package is provided. For example, a guide groove 9 of the terminal 8 of the package is provided at the periphery of a molding material 7 thereby to eliminate the occurrence of the bents of the legs. In order to effectively utilize the space under the package, a protrusion 11 is formed at the lower part of the package to enhance a board mounting efficiency by disposing other electronic components 12 under the package. |
