| 摘要 |
PURPOSE:To improve the ability to radiate heat and the electrical transmission characteristic, by connecting electrode parts on an insulating base substrate with an electrode part on an insulating cap substrate by using a conductive material. CONSTITUTION:A chip 1 is connected with electrode parts of wirings formed on an insulating base substrate 6 by wire bonding 2 or another method and the electrode parts of the ends of wirings on the insulating base substrate 6 are connected with electrode parts 11 of an insulating cap substrate 8 through a wiring enlarging layer 10 and solder bump. Therefore, the insulating cap substrate 8 of a simple structure including conductive layers 4 perpendicular to the substrate 6 can be used even if cavity down structure is employed, and the propagation path to pass a current through the substrate 8 and the delay of the propagation time can be minimized even if said substrate 8 is made of a material of a high dielectric constant such as ceramics. This enables mounting a chip radiating a large quantity of heat and achieving high-speed electrical transmission characteristic. |
