| 摘要 |
PURPOSE:To enable an optical characteristic to be unified by heating under a specific condition after resin sealing so as to adjust a light transmitting characteristic of transparent resin. CONSTITUTION:An infrared ray reflection type sensor has a transparent epoxy resin part 1 covering the surface of a light-receiving semiconductor chip 3 placed on a lead wire 5a and a transparent epoxy resin part 1 covering the surface of a light-receiving semiconductor chip 4 placed on a lead wire 5b. Then, the transparent epoxy resin part 1 contains an imine black color, in which light transmittivity in a specific wavelength range changes by a chemical change due to heating and after sealing both semiconductor chips 3 and 4 together with an opaque resin part 2, a light transmitting part 1 is given heat treatment at 80-180 deg.C for one min-6hours in order to adjust light transmittivity. Thereby, the variations of a product can be reduced. |
