发明名称 FORMING METHOD FOR VIA-HOLE OF CERAMIC MULTILAYER BOARD
摘要 PURPOSE:To prevent a recess from generating at the connection part of a via- hole and to stabilize an electric connection of the via-hole by forming a through hole passing through integrally a base sheet adhering to a green sheet, filling conductive paste in the hole, drying it and peeling the sheet. CONSTITUTION:A sheet material 2 to become a base sheet adheres to one side face of a green sheet 1, a through hole 3 integrally passing through the sheet 1 and the material 2 is formed, conductive paste 4 is filled in the hole 3, dried, cured, and the material 2 is peeled to be removed from the sheet 1. Then, the paste 4 filled in the hole 3 at the side of the material 2 remains in a state (d) of the drawing on the sheet 1. In this case, the paste 4 is lightly press-molded from its outer end face. Thus, a viahole having no recess is formed, and a stable electric connection can be obtained.
申请公布号 JPH01253994(A) 申请公布日期 1989.10.11
申请号 JP19880081838 申请日期 1988.04.01
申请人 MURATA MFG CO LTD 发明人 MORIMOTO RYOICHI;OTA HIROYUKI;KODO GIICHI;HATA TOSHIO
分类号 H05K3/46 主分类号 H05K3/46
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