| 摘要 |
A method of coating for defining wire bond and solder bond pads on the side facets of a submount block (5). A substrate (23) of insulating material is coated on its front face (17) with metal and channels (33, 35) are cut into this face (17) to define the sidewalls of an array of blocks. The substrate (23) is coated with a layer of dry film resist (37) by e.g. a hot vacuum technique, windows (41, 39) over the channels (33, 35) defined, and metal deposited. Further metal is then added by plating, the surrounding metal coating removed, and the blocks (5) separated by cutting from the reverse side of the substrate (23). |
