| 摘要 |
<p>A room temperature curing resin compound that can be used as a potting material, which comprises (A) an organic polymer comprising a main chain polymeric portion (a) having a molecular weight of 300 to 30,000 and having carbon-carbon double bonds of an iodine value of 50 to 500 and an acid group (b) linked to the main chain polymeric portion, the acid group being of a general formula <CHEM> and being contained in a ratio of 0.05 to 0.5 mole per 100 g of component (A), (B) a polyol having at least two hydroxyl groups in one molecule, and (C) a curing promoter, the ratio of the acid group (b) of component (A) and the hydroxyl group of (B) being 0.5 to 1.5, with or without the addition of a plasticizer.</p> |
