发明名称 |
MANUFACTURING A LAMINATED PRINTED CIRCUIT BOARD |
摘要 |
A process if provided for making a laminated board for use in printed circuitry. The process involves laminating a metal layer (4) to at least one side of a sheet of porous, expanded polytetrafluoroethylene (2) using an adhesive (3) followed by compressing the polytetrafluoroethylene sheet to increase its density. The metal layer may be a metal foil or it may comprise electrical circuitry. |
申请公布号 |
GB2216461(A) |
申请公布日期 |
1989.10.11 |
申请号 |
GB19890004557 |
申请日期 |
1989.02.28 |
申请人 |
* JUNKOSHA CO LTD |
发明人 |
MASAHIRO * SUZUKI;SATOSHI * TANAKA |
分类号 |
B32B5/18;B32B15/08;B32B15/092;H05K1/03;H05K3/28;H05K3/38 |
主分类号 |
B32B5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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