| 摘要 |
PURPOSE:To prevent an Al layer from corroding for improving the moisture resistance, by making a two-layer pad electrode comprising the Al layer and a barrier metal layer. CONSTITUTION:An Al layer 3 and a barrier metal layer 4 are accumulated in this order on an insulating film 2 formed on a semiconductor substrate 1 and selectively etched by turns to form a pad electrode comprising the Al layer 3 and the barrier metal layer 4 accumulated thereon. A layer insulating film 5 is accumulated on the surface including the pad electrode and an opening is made at the center of the layer insulating film 5 on the pad electrode. An Au ball formed by shaping the end of an Au wire in spherical form is stuck by thermocompression bonding on the barrier metal layer 4 of the opening and the Au wire on the Au ball is cut off by vibrating a capillary to form a bump electrode 6. This prevents the Al layer 3 from being corroded by water intruding into the surface of the Al layer 3 and the Au ball from coming off because of a brittle alloy produced on the boundary surface between the Al layer 3 and the Au ball. |
