| 摘要 |
PURPOSE:To make uniform the heating condition of a semiconductor substrate arranged in a vessel by a method wherein the treatment vessel is constituted of a case body part having an inlet port and an exhaust port, and having circulating holes for a cooling fluid at the inside of the body, and of a flat board type top plate consisting of transparent quartz, and infrared lamps for heating by radiation are provided at the upper part of the top plate. CONSTITUTION:The supporting stainless steel frame 8 to constitute the cylindrical side wall is provided on the stainless steel base 7 having the inlet port 15 and the exhaust port 16, and the top plate 9 consisting of the transparent quartz flat board is put on the upper face of the supporting frame 8 being supported with the ring type fixing frame 10. At this construction, circulating paths 11 for cooling water are formed respectively in the supporting frame 8 and the fixing frame 10, a supporting desk 12 to mount the semiconductor substrate 13 is provided in space surrounded with the supporting frame 8, and a thermally shielding plate 17 of opaque quartz is arranged at the lower side thereof. After then, the infrared lamps 14 for heating are provided at the upper part of the plate 9 interposing the prescribed interval between them, and the surface of the substrate 13 is heated by direct radiation through the plate 9. |
