| 摘要 |
<p>PURPOSE:To form a semiconductor device requiring a thin package like an IC card with a window material like an EPROM or the like in a simplified steps by joining and securing pads to conductive leads by a transmitting member or transparent resin for connecting the member to a semiconductor element. CONSTITUTION:Addition silicone resin of polysiloxane skeleton having a methyl group at a side chain is dropped on the surface of an EPROM chip 4' having bumps 7, conductive leads 3b are aligned to the bumps 7, and a lead frame 3 is mounted. When they are so thermally cured in a pressurized state by a clamping jig as to obtain electric connections of the leads 3b to the bumps 7, a transmitting member 14 with an ultraviolet ray transmission window of silicone resin is obtained. Then, the frame 3 bonded with the chip 4' is inserted into a metal mold, and molded by transfer molding with sealing resin 5 made of epoxy resin containing inorganic filler such as SiO2, thereby obtaining an EPROM package. The package is mounted on the sheets 1a, 1b, 1c of an IC card made of polyvinyl chloride, and secured with epoxy resin adhesive 6. Thus, a semiconductor device requiring a thin package having the window material can be formed in simple steps.</p> |
