| 摘要 |
PURPOSE:To reduce the Joule's heat generated in a semiconductor substrate by a method wherein the rear surface of a semiconductor substrate of a field- effect transistor is bonded onto a non-metallized ceramic surface of a transistor package. CONSTITUTION:A non-metallized part 30 is provided on the second metallized surface of a common grounding electrode 22 out of an input, the common grounding and an output electrodes 21, 22 and 23 having the first, the second and the third metallized surfaces of a ceramic substrate 1 so that the rear surface of a semiconductor substrate 3 of a field effect transistor may be bonded onto the part 30 by a thermal conductive bonding agent etc. An input terminal 81 and an output terminal 82 are respectively connected to the input electrode 21 and the output electrode 23. In such a constitution, the semiconductor substrate 3 and a common ground bonding pads 5 are electrically connected on the surface of the substrate 3 while input, common grounding and output pads are respectively connected to the input, common grounding and output electrodes 21, 22 and 23. |
