| 摘要 |
PURPOSE:To eliminate the variation of discharge of a die bonding paste and to apply the paste uniformly by a method wherein the die bonding paste is applied by a transfer printing of an offset system using rools and this is turned into a B stage by preheating. CONSTITUTION:A die bonding paste 2 is subjected to transfer printing on a semiconductor element mounting part on a lead frame 9. First, the paste 2 is transferred on a roller from a paste tank 1 via a coating roller 3. This paste is transferred on a mixing roller 5 and moreover, is transferred on a printing roller 8 through a forme roller 6 and a forme cylinder roller 7. This roller 8 is made to descend to coat the paste 2 on the surface of the semiconductor element mounting part on the lead frame 9. The frame 9 provided with the semiconductor element mounting part, whose surface is coated with the paste 2, thereon is heated while being moved on a heating zone 10 provided with heating units 11-14, which are respectively set at a prescribed temperature, to remove a diluting solvent.
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