| 摘要 |
PURPOSE:To obtain a high-density multiwire wiring board with a small diameter insulating wire which has remarkably low occurrence rate of wire breaking and has an excellent connection reliability, by using an insulating wire which is made by unifying several pieces of metal leads with insulating resin and by coating its surface with an adhesive resin layer, for wire pattern formation. CONSTITUTION:On the surface of a metal lead 8, self-welding insulating resin is coated. Several pieces of such metal leads are combined so as to get a desired outer diameter and are unified by heating. After that, an adhesive resin layer 10 is coated. As a metal lead, a wire of 10-50mum in diameter made of copper, copper alloy, Sn- or Ag-plated copper, nickel or nickel alloy is used. As insulating resin, self-adhering epoxy resin, polyvinyl butyral resin, polyester resin, etc., can be used. As adhesive resin to be coated for improving adhesion to an adhesive sheet, a compound of saturated polyester resin, phenoxy resin and thermosetting resin is used. |
