| 摘要 |
<p>PURPOSE:To manufacture the title hybrid IC easily in high productivity by a method wherein conductor layers are print-formed on both surfaces of a substrate and then insulating films are further print-formed on these conductor layers and after print-forming circuit layers on these insulating films, electronic parts are mounted on these circuit layers. CONSTITUTION:Conductor layers (metallic conductor layers)2 are print-formed respectively on the surface and rear surface of a substrate. Next, insulating films 3 are further print-formed respectively on the surface and rear surface of the conductor layers 2. Then, after print-forming circuit layers (conductor patterns)4 on the surface and rear surface of the insulating layers, electronic parts (chip parts such as diode, transistor, capacitor, semiconductor integrated circuit etc.) 5 are mounted on respective circuit layers (surface and rear surface of circuit layers) 4. Respective layer bodies (conductor layers 2, insulating layers 3, circuit layers 4) are formed easily by print-screening process etc. Through these procedures, respective conductor layers 2, insulating layers 3 and circuit layers 4 can be print-formed so that the title hybrid IC may be manufactured easily to enhance the productivity.</p> |
