Device for wave soldering of printed circuit board assemblies

摘要

In the case of a device for wave soldering of printed circuit board assemblies, a soldering frame with central supports is normally used to avoid the printed circuit board assemblies bending, which soldering frame suspends said printed circuit board assemblies. In order to be able to carry out wave soldering of printed circuit board assemblies in a manner which is as simple as possible and without using soldering frames, at least one supporting element (7, 8, 9) is arranged in front of and behind the soldering bath (LB), in the course of a transportation device (TE), such that the printed circuit board assemblies (4) are supported. The supporting elements (7, 8, 9) are arranged such that they can be displaced transversely with respect to the movement direction of the printed circuit board assemblies (4). The device is also suitable for wave soldering of very broad printed circuit board assemblies. <IMAGE>