| 摘要 |
A tape automated bonding tape segment (10) carries on its top surface a printed circuit interconnect conductor high-density array (14) having a plurality of signal, power and ground conductors (16). Burn-in testing pads (40) are formed on either the top surface or the bottom surface of the tape segment, or both, and are connected to selected conductors. The testing pads are spaced apart and have a relatively low density to facilitate contact with test equipment, whereby a die connected to the printed circuit array can be tested. |
