STRUCTURE FOR INTERCONNECTING SEMICONDUCTOR CHIP

摘要

PURPOSE:To reduce the thickness of a structure for interconnecting a semiconductor chip by forming each of electrode forming parts within the semiconductor chip with a surface which is inclined with respect to the rear of the semiconductor chip. CONSTITUTION:Each of electrode parts of a semiconductor chip 1 is formed so that its surface is inclined with respect to the rear of the chip by an anisotropy etching or other means at the formation of the chip. An electrode of the semiconductor chip 1 is connected to an electrode part of a lead frame 3 formed on the surface inclined with respect to the rear of the semiconductor chip 1 by a bonding wire 5. Accordingly, it is possible to reduce the maximum height a of the wire and the thickness between the upper end of a sealing cap 4 and the lower end of a holding plate 2.