| 摘要 |
PURPOSE:To prevent the expanse of a heat affecting part by suppressing the expanse of the bead width in the bonded part of a thin leaf spring, by providing a recessed part to the part to be bonded of the first member to preliminarily reducing the thickness thereof and irradiating the recessed part with electron beam on the opening side of said recessed part. CONSTITUTION:A leaf spring 7 and the armature 6 corresponding to the second member are superposed one upon another and the recessed part 15 of the leaf spring 7 is irradiated with electron beam or laser beam on the opening side thereof as shown by an arrow. The recessed part 15 is divided into semicircular regions while the semicircular regions are respectively separated irradiated with separate electron beams and, at this time, said electron beams are allowed to irradiate from the peripheral edge of said recessed part toward the center thereof while being moved. By this bonding method, the expanse of a heat affecting part can be prevented before the molten bonded state of both of the them becomes sufficient enough. Therefore, the embrittlement of the torsion bar of the leaf spring 7 and a bending arm can be especially prevented while the bonding strength of the bonded part is sufficiently obtained. |
