发明名称 METHOD FOR FORMING PATTERN OF CERAMIC WIRING BOARD
摘要 PURPOSE:To eliminate highly accurate control of the position of a nozzle along the height direction and avoid sticking of the nozzle tip caused by drying by a method wherein powder particles for forming a pattern are spouted out against a ceramic wiring board whose surface is coated with thermally decomposed organic adhesive to draw a required pattern. CONSTITUTION:Organic adhesive 2 is applied to the surface of a ceramic wiring board 1. Then powder particles 3 of pattern forming powder are spouted out against the organic adhesive 2 on the board surface from the spouting outlet of a nozzle 4 provided above the board surface with a predetermined interval. The nozzle 4 moves lengthwise and crosswise and spouts out the powder particles 3 against the organic adhesive 2 in accordance with the required pattern data to form and fix the required pattern. The highly accurate setting of the distance between the tip spouting outlet and the surface of the ceramic wiring board 1 is not necessary for the spouting out from the nozzle 4 like this. Then the ceramic wiring board 1 with the powder particles 3 is put into a baking furnace 5 and baked. Therefore, the powder particles 3 are sintered with the ceramic wiring board 1 as a pattern 6 and, at the same time, the organic adhesive 2 is evaporated and the required pattern 6 is formed on the ceramic wiring board 1.
申请公布号 JPH01248591(A) 申请公布日期 1989.10.04
申请号 JP19880077190 申请日期 1988.03.29
申请人 NEC CORP 发明人 NISHIKAWA TOSHIAKI
分类号 C04B41/88;C09J201/00;H05K3/10;(IPC1-7):H05K3/10;C09J3/00 主分类号 C04B41/88
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