发明名称 MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To laminate the laminate of a molding blank while keeping the position of lamination with high accuracy, and to obtain a product having high quality by inserting an expansion ring made of a soft metal having ductility into a reference hole formed in the laminate, expanding the ring, fast sticking and fixing the ring and hot-pressing and molding the laminate. CONSTITUTION:Reference holes 5 are formed at the end sections of a laminate 4 in which printed wiring boards 1 for internal layers and copper-clad laminated boards 3 are superposed together with prepregs 2, and expansion aluminum rings 6 are inserted into the reference holes 5. The laminate is contact-bonded by an expansion tool 7, an upper end of which is thinned, from the upper and lower sections of the expansion aluminum ring 6, and tightly stuck into the reference hole 5 by pushing and spreading the expansion aluminum ring 6. The position of laminating of the laminate 4 is fixed, the laminate 4 is hot- pressed and molded, and an external-layer printed circuit, etc., are shaped, thus finishing the laminate to a multilayer printed interconnection board. Accordingly, the multilayer printed interconnection board can be molded with high accuracy and excellent operating efficiency.
申请公布号 JPH01248695(A) 申请公布日期 1989.10.04
申请号 JP19880076815 申请日期 1988.03.30
申请人 AICA KOGYO CO LTD 发明人 MURAMATSU TATSUYOSHI;ANDO MITSUO
分类号 H05K3/46 主分类号 H05K3/46
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