| 摘要 |
<p>PURPOSE:To obtain a thin-type high-density memory card, by a construction wherein a memory IC chip is embedded in an opening provided in a card frame, and two adjacent sides of the chip are disposed in contact with two adjacent sides of the opening which are provided with a total of at least three positioning protrusions located dispersedly. CONSTITUTION:A card frame 1 is provided with a plurality of openings 2, in each of which a memory IC chip 3 is embedded. Two adjacent sides of each of the memory IC chips 3 is disposed in contact with two adjacent sides of the opening 2 which are provided with a total of three positioning protrusions 41-43 located dispersedly. The protrusions 41-43 sets the relative positions of the IC chips 3 with high accuracy. Because the relative positions of the memory IC chips are set with high accuracy by the two sides, provided with the positioning protrusions, of each of the openings, a memory card with high reliability can be obtained through a simple process and in a high yield.</p> |
