| 摘要 |
PURPOSE:To protect a blind through-hole against an etchant at the time of etching by filling the inside of the blind through-hole with solder resist ink, attaching a solder plating layer and coating a copper-layer exposed section of the surface of the inwall of the blind through-hole. CONSTITUTION:A copper plating layer (a copper layer) 5 and a copper plating layer (a copper layer) 3 are executed onto the section of a blind through-hole 2 and a copper foil layer 8 on the surface side, and the copper layer 5 in the blind through-hole 2 is filled with solder resist ink 6 and an innermost section in the hole 2 is also coated. Ink 6 is dried, the upper, section of the copper layer 3 on the surface side is coated with a photosensitive resin film 7, an original picture mask pattern is printed and developed to a substrate, a solder plating layer 4 is executed to the blind through-hole 2 section, and the photosensitive resin film 7 is peeled and etching is conducted. Accordingly, the surface of the copper layer 5 is coated completely, thus preventing the corrosion of the copper layer 5 on the inwall of the through-hole 2 by an etchant at the time of etching operation by using a coated layer. |
