发明名称 |
Semiconducting device mounting. |
摘要 |
<p>A technique for assembling semiconductor devices in which semiconductor elements, especially lasers or LEDS, are mounted on a first packaging element such as a heat spreader that is mounted on a second packaging element such as a heat sink. Handling of solder preforms is avoided by coating at least one of each of the pairs of surfaces to be brought into contact with a layer of solder and heating the assembly to melt both solder layers in a single operation. In a preferred embodiment a heat spreader is coated in solder on both sides and interposed between a semiconductor element and a heat sink and the assembly is heated. Molybdenum may be used as a layer to aid wetting and adhesion and gold/tin solder may be used. Slightly different solidification temperatures and compositions for the layers may result from different take up of metallisation layers from the components into the solder.</p> |
申请公布号 |
EP0335744(A1) |
申请公布日期 |
1989.10.04 |
申请号 |
EP19890303227 |
申请日期 |
1989.03.31 |
申请人 |
BT&D TECHNOLOGIES LIMITED |
发明人 |
REGNAULT, JOHN CHRISTOPHER |
分类号 |
H01L23/40;H01L21/48;H01L21/60;H01S3/04;H01S5/00;H01S5/02;H01S5/024 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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