| 摘要 |
PURPOSE:To prevent registration error in a method by which two copper single plates are heated and laminated, and to rationalize the heating laminating process of a copper single plate by forming the single copper plate as a single internal layer. CONSTITUTION:A copper foil 1 in specified thickness is prepared, a through-hole is drilled at a predetermined position through drilling and a clearance 2 is shaped. An insulating resin 3 is printed from the surface and the rear through a screen printing method, the inside of the clearance 2 is filled with the resin 3, and the insulating resin 3 is cured and molded through baking treatment, thus acquiring a single internal layer. A power supply layer 4 obtained in this manner and a grounding layer 5 are heating-laminated on external-layer conductor layers 7 through prepreg 6, and through-holes 8 are formed through drilling, panel plating and a photocopying method, thus acquiring a multilayer printed interconnection board 9. Accordingly, an error in registration is not generated, thus reducing cost. |
