IC packing device with impedance adjusting insulative layer.

摘要

There is disclosed a mounting structure for a semiconductor integrated circuit device or IC device having signal transmission terminals, which has an insulative substrate (16) on which the IC device is mounted, a conductive signal transmission wiring line (24) formed on the substrate (16) and electrically connected to a selected one of the signal transmission terminals of the IC device, and an insulative resin layer (F) formed on the substrate (16) to at least partially cover the signal transmission wiring line (24). The insulative resin layer (F) functions to change and set the impedance of the signal transmission wiring line (24) to a desired impedance value. The insulative resin layer (F) is formed to have a selected thickness such that the characteristic impedance of the wiring line, which tends to fluctuate in the wiring line etching formation process, can be adjusted and set towards a destination characteristic impedance.