LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

A lead frame and method for processing the lead frames from a continuous strip of lead frames (11). A first insulation support member (30) and a second insulative support member (32) are first molded to the lead frame. After the support members are formed, the positioning member for supporting the leads within the lead frame is stamped from the lead frame. After an integrated circuit (IC) is connected to the leads, the IC can be tested within the lead frame since the leads are electrically isolated from the lead frame and each other. Finally the IC can be encapsulated and the leads severed from the lead frame assembly.