发明名称 TAPE BONDING METHOD
摘要 PURPOSE:To carry out bonding of a carrier tape without sticking of foreign matter to a bonding tool by providing an intermediate member between the bonding tool and the carrier tape. CONSTITUTION:When the carrier tape 1 is sent and a lead 2 is positioned and a bump 8 of a pellet 9 to be bonded is interfaced with the lead 2, a vacuum adsorption base 6 rises and the bump 8 abuts on the lead 2. The bonding tool 3 is then moved and lowered in the XY directions and the lead 2 is pressed on the bump 8 via the intermediate member 5 to carry out bonding. By this method, the bonding without sticking of the foreign matter to the bonding tool can be carried out.
申请公布号 JPH01249280(A) 申请公布日期 1989.10.04
申请号 JP19880073243 申请日期 1988.03.29
申请人 SHINKAWA LTD 发明人 YAMAZAKI NOBUHITO
分类号 H01L21/60;B23K20/02;B23K20/10;B23K20/26;H01L21/00 主分类号 H01L21/60
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