| 摘要 |
<p>PURPOSE:To obtain an adhesive thin plate for fixing a wafer which does not show isolation of small pieces of element even under the solvent washing process by using an adhesives of bridge type aclyric system having a particular mean melcular weight which does not substantially use a solvent as a pressure sensible adhesive layer. CONSTITUTION:Ethyl acrylate, 2-ethyhexylacrylate, acrylonitrile, acrylic acid, polyoxylethylenealkyl-phenolether (emulsifier), ammonium persulfate and ion exchange water are used, the emulsion polymerization is carried out under the nitrogen atmosphere, and thereby an emulsion system acrylic copolymer of mean molecular weight of 1,500,000 can be obtained. Toluene is added in order to obtain 30% solution of toluene and a polyisosianate compound is mixed as the bridging agent. A obtained material is coated on a polyethylene film and a separator consisting of the polyester film is temporarily deposited on the paste surface. Co-polymerization is carried out so that the mean molecular weight of at least 800,000, more desirably of 850,000-1,500,000 can be obtained. If it is less than 800,000, an adhesive force is lowered.</p> |
