发明名称 LAMINADOS PLASTICOS REFORCADOS PARA APLICACAO DE PAINEIS DE CIRCUITO IMPRESSO E PROCESSO PARA FABRICAR OS DITOS LAMINADOS E PRODUTOS RESULTANTES
摘要 A warp-free laminate is produced by winding a first set of strands or filaments (34) about a flat mandrel with a second set of strands (36) being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings (106, 108, 110, 112, 114) for subsequent printed circuit applications. <IMAGE>
申请公布号 BR8707854(A) 申请公布日期 1989.10.03
申请号 BR19878707854 申请日期 1987.09.10
申请人 COMPOSITECH, LTD. 发明人 JONAS MEDNEY;FRED E. KLIMPL
分类号 B32B15/08;B29B15/10;B29B15/12;B29C53/56;B29C53/58;B29C53/76;B29C53/80;B29C70/06;B29C70/10;B29C70/16;B29C70/20;B29C70/34;B29K105/08;B29L9/00;B29L31/34;B32B5/12;B32B5/28;C08J5/24;H05K1/02;H05K1/03;H05K3/00;H05K3/36;H05K3/46;(IPC1-7):B32B5/12;B31C13/00;B32B31/00 主分类号 B32B15/08
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