发明名称 Method of manufacturing printed circuit boards
摘要 A method of manufacturing printed circuit boards. An environmentally safe method for manufactured printed circuit boards using additive technology provides a simple and exact transfer of conductor patterns. The novel method provides a selective ablation of a nucleation, B, applied to a substrate either by itself or together with a thin base layer, G, applied by chemical metal deposition. This ablation is done by electromagnetic radiation preferably with an excimer laser in those regions of the substrate that do not correspond to the conductor tracks and/or interlayer connections or through-connections to be formed later. Conductor material is subsequently built up by chemical and/or galvanic metal deposition.
申请公布号 US4870751(A) 申请公布日期 1989.10.03
申请号 US19880176325 申请日期 1988.03.31
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ANTOON, MATTELIN
分类号 C23C18/16;C23C18/20;C23C18/30;C23C18/31;C23C18/40;C23F4/04;H05K1/03;H05K3/18;H05K3/42 主分类号 C23C18/16
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