发明名称 FLUIDIZATION PLATING METHOD FOR FINE METAL POWDER
摘要 PURPOSE:To form a uniform plating layer on the surface of fine metallic powder by bringing fluidized fine metallic powder into contact with a cathode in a plating tank having an anode at the upper part and the cathode at the bottom at the time of plating the surface of finely powdered metal with another metal. CONSTITUTION:The fine metallic powder 3 is suspended in an electrolyte 5 in the plating tank having the anode 1 at the upper part and the cathode at the bottom, sucked by a pump P from the bottom, passed through a circulating pipe 6, dropped from above the plating tank, and again circulated. In the course of circulation, the power 3 is brought into contact with the cathode 2, and then forms the surface layer 4 of the layer 3 of deposited fine metallic powder. An electric current is applied between the anode 1 and the cathode 2, and the metal ion in the electrolyte 5 is electrodeposited as the metal. Since the surface of the layer 3 of the deposited fine metallic powder in the plating tank is renewed by the circulation of the electrolyte 5 through the pipe 6, and all the fine metallic powder is uniformly plated with the metal in the electrolyte 5.
申请公布号 JPH01247594(A) 申请公布日期 1989.10.03
申请号 JP19880077015 申请日期 1988.03.29
申请人 FUJI KOBUNSHI KK;NINOMIYA KAITO 发明人 NINOMIYA YAMAHITO;NINOMIYA KAITO;YOTSUYA TERUHISA
分类号 C25D7/00;(IPC1-7):C25D7/00 主分类号 C25D7/00
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