| 摘要 |
A modular packaging structure consisting of a plurality of modules, each capable of performing different functions, coupled to a central core. The modules are comprised of a pair of half semiconductor wafers bonded together. Each wafer contains a plurality of semiconductor devices inset in the wafer and having interconnect lines connecting the devices to the wafer. The module has a plurality of contacts along the straight edge to allow coupling. The straight edge of the module is inserted into a core of the modular computer. The core acts as a power and signal bus to the modules and serves to clamp the modules in place. A slot in the core is left for the external electrical connections. A cooling manifold can be disposed about the modules to provide air cooling. The structure is then placed in a housing having a fan to pump air through the cooling manifold.
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