| 摘要 |
PURPOSE:To make assembly efficiency in manufacture goods and to reduce manufacturing cost, by a method wherein a substrate on which a LED diode and a LSI chip are mounted is fitted in a cover of an airtight structure united while a lens making sealing agent lies between both. CONSTITUTION:A lens array 2 is placed into a long hole 1b for a lens of a cover 1, a male screw is engaged with a hole 1c for a screw of the cover 1, and the hole 1b for the lens of the cover 1. Linearity of the lens array 2 fitted into the long hole 1b for the lens of the cover 1 is maintained thereby. Then, silicone 4, 5 is filled above a head of a male screw 3 and around the lens array 2, and the lens array 2 is airtightly united with the cover 1. Thereafter, a substrate 6 on which a LED diode array 7 and a LSI chip 8 controlling the LED diode array 7 are mounted, is fitted into a depressed part 1a of the cover 1 after placing sealing agent 9 on a peripheral wall of the depressed part 1a of the cover 1. |
