| 发明名称 |
HEAT-DISSIPATING SUBSTRATE COMPOSED OF BORON-BASED COMPOUND SEMICONDUCTOR; ITS MANUFACTURE; BORON-BASED COMPOUND SEMICONDUCTOR ELEMENT |
| 摘要 |
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| 申请公布号 |
JPH01243563(A) |
申请公布日期 |
1989.09.28 |
| 申请号 |
JP19880069706 |
申请日期 |
1988.03.25 |
| 申请人 |
AGENCY OF IND SCIENCE & TECHNOL;NATL INST FOR RES IN INORG MATER;RIGAKU KEISOKU KK |
发明人 |
KUMASHIRO YUKINOBU;MIHASHI TAKEFUMI;OKAYA SHINICHI;MUTA FUMIHITO;KOSHIRO TAKESHI |
| 分类号 |
H01L23/34;H01L21/205;H01L23/36;H01L23/373;H01L29/861 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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