| 摘要 |
<p>PURPOSE:To make it possible to mount a surface mounting component on a printed-wiring board with a high reliability of connection even though there exists a warpage in the printed-wiring board by a method wherein the printed- wiring board is provided with recessed parts, each using a mounting component mounting pad as its bottom surface and using an insulating layer as its sidewall, and a solder filled in the recessed parts. CONSTITUTION:After an insulating layer 113 having a constant thickness is further laminated on a component mounting surface, the insulating layer only on mounting component mounting pads 108 is removed by etching and a solder 110 is flowed in recessed parts generated by etching. That is, in case a printed- wiring board warps, for example, in its upper direction, the peripheries of the pads 108 are surrounded with the layer 113 in a constant thickness and the solder 110 can be kept stored by the amount of this thickness. Thereby, as there exists an allowance 60 the upper and lower positional deviations of pins 112 of a PGA case 111, a surface mounting component can be mounted on the printed-wiring board easily with a high reliability.</p> |
