| 摘要 |
A cooling device for electric and/or electronic components, the device being characterised by a main body (31 )for providing a component support or mounting surface (32) affording good thermal contact and heat transfer between the main body and the component mounted thereupon, the main body having owtwardly extending arms provided with heat transfer surfaces (35,) which together with further sets of heat exchange surfaces (39) connecting with the main body, project outwardly from the arms and the main body in such direction and manner that they do not limit the size of a component mounted to the support or mounting surface. |
