发明名称 |
THERMOPLASTIC SOLDERING MATERIAL, PROCESS AND DEVICE |
摘要 |
The soldering material (LM) is produced from fine-grained soldering metal (MG) and a thermoplastic bonding material (BM) in a plastifier (P). It is applied to the object (LG) to be soldered (e.g. printed circuits or components) through screen process (SD) application. Below the plastification temperature (TP) the object to be soldered can be stored or transported at will. The soldering object (LG) is fitted with components (BE) in a heat zone (HZ). After additional storage (L1) and transport (T1) at low temperature, at which the components (BE) are fixed using the bonding material (BM), the bonding material (BM1) may be decomposed and volatilized in a soldering zone (LZ) at a temperature above the soldering and vaporization temperature (TF). |
申请公布号 |
DE3665141(D1) |
申请公布日期 |
1989.09.28 |
申请号 |
DE19863665141 |
申请日期 |
1986.03.14 |
申请人 |
KAWE ELECTRONIC GMBH & CO. KG |
发明人 |
WENDISCH, KARL, HEINZ |
分类号 |
B23K;B23K35/22;B23K35/363;H05K;H05K3/12;H05K3/32;H05K3/34;(IPC1-7):B23K35/363 |
主分类号 |
B23K |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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