| 摘要 |
The invention relates to a method for removing organic and inorganic residual products prior to a soldering process. According to a known method, the steps of a) flux treatment for removing oxides, residues of acid, and grease (fat), b) heating, c) soldering, and d) washing of the object to the soldered, e.g. a printed circuit take place. According to the proposed method, the washing is carried out immediately prior to the soldering process, which thus constitutes the last process step. Washing can be carried out with water in two stages, the areas to be soldered being coated, in the last washing stage, with a carrier/solvent for surface protection, in order to prevent oxidation prior to the soldering process. <IMAGE>
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