Method and device for cleaving a silicon wafer.

摘要

The invention makes possible the cleaving of a silicon wafer which has at least one flat surface machined on its circumference and oriented at 90 DEG in relation to the lines of cleaving of the wafer. The method consists in: - positioning the wafer (2) on a support (4) in relation to a stressing tool (14) in a determined position, - fixing the wafer (2) in this position, - cleaving the wafer (2) by controlled action of the tool, by virtue of cleaving stresses which make possible the instantaneous rupture of the wafer (2). The cleaving device also comprises a sighting device (20) which is translationally mobile in the same way as the stressing tool (14). Applies to silicon wafers used as supports for printed circuits. <IMAGE>