| 发明名称 |
FABRICATION OF A MULTILAYER CONDUCTIVE PATTERN ON A DIELECTRIC SUBSTRATE |
| 摘要 |
<p>A pattern of conductive material (12'/14) is formed on a substrate of dielectric material. The substrate comprises a layer of flexible dielectric material (4) having a layer of dimensionally-stable material (6) adhered to one main face. The pattern is formed on the opposite main face of the layer of flexible dielectric material.</p> |
| 申请公布号 |
EP0295848(A3) |
申请公布日期 |
1989.09.27 |
| 申请号 |
EP19880305378 |
申请日期 |
1988.06.13 |
| 申请人 |
TEKTRONIX, INC. |
发明人 |
REAGAN, JOHN J.;PARKS, PEGGY J.;MILLER, NANCY L.;BECKMAN, ROBERT L. |
| 分类号 |
H01L21/48;H05K1/00;H05K1/05;H05K3/00;H05K3/10;H05K3/38;H05K3/46;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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