发明名称 WIRE BONDING STRUCTURE OF ELECTRONIC COMPONENT
摘要 PURPOSE:To prevent an electrode from corroding, by sequentially forming a passivation film having an opening narrower than the extending diameter of the tip of a wire at the time of bonding and a flexible resin film in this order on the electrode, and connecting the tip of the wire to the electrode through the opening. CONSTITUTION:An aluminium electrode 3 is formed on an insulating film 2, and a passivation film 4 made of PSG, SiNx or the like and a flexible resin film 7 made of polyimide or the like are further formed on the upper part of the electrode. Openings 5 narrower than the extending diameter of the tip of a wire at the time of bonding are respectively formed at the films 4 and 7. When the bonding is completed, the extending diameter Wb of the tip of the wire is larger than the inner diameter Wh of the opening. Thus, the periphery of the opening 5 is covered with the ball at the tip of the wire 6. Accordingly, an exposed part is not presented on the electrode 3 in this state, thereby improving corrosion resistance of the electrode in an atmospheric environment.
申请公布号 JPH01241832(A) 申请公布日期 1989.09.26
申请号 JP19880070754 申请日期 1988.03.23
申请人 ROHM CO LTD 发明人 MATSUO KOZO
分类号 H01L21/60 主分类号 H01L21/60
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