| 摘要 |
<p>SELF-CONTAINED THERMAL TRANSFER INTEGRATED CIRCUIT CARRIER PACKAGE A semiconductor carrier package to accommodate single or multiple integrated circuits. This such package being enhanced with a micro-engineered thermal transfer apparatus which effectively removes the large heat fluxes generated in such applications. Said apparatus being completely self-contained and independent of any external systems of coolant pumps, collection or heat transfer systems. Coolant flow is internally perpetuated by the heat generated by these semiconductor circuit(s) and no moving mechanisms are generally employed. The invention is a spacially compact integrated circuit package unit with minimal mass and high thermal removal efficiencies. The lack of complex components or moving mechanisms also increases the reliability of the package making it virtually maintenance free.</p> |
