| 摘要 |
PURPOSE: To prevent a pin from being deformed and to provide the mechanical and static shielding protection by providing a shell with a wall device projecting from a bottom wall for supporting a dual in-line package integrated circuit component carrier of 300, 400 or 600 mil. CONSTITUTION: A carrier 10 is manufactured by molding a conductive polymer synthetic, and a shell 12 compreises a bottom wall 15, end walls 16, 17, a front wall 18 and a back wall 19. A wall which is separated to be fitted between the pin arrays of a dual in-line package(DIP) integrated circuit(IC) element is projected from the bottom wall into the shell 12 for holding a pin. The first walls 20, 21 receive a 300 mil DIP, and its outer face is separated by 0.71 cm. The outer faces of the second walls 27, 28 are fitted between the pins of 400 mil DIP, and separated by 0.97 cm, and the third walls 34, 35 are formed to receive a 600 mil DIP and separated by 1.5 cm. The carrier 10 can accommodate an IC unit of one of 300, 400 and 600 mil DIP components in common.
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