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发明名称
LEAD BONDER
摘要
申请公布号
JPH01241889(A)
申请公布日期
1989.09.26
申请号
JP19880070004
申请日期
1988.03.24
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
MAKINO YUTAKA;ANDO TAKEO;KABESHITA AKIRA
分类号
H05K3/32;H01L21/60;H01L21/603
主分类号
H05K3/32
代理机构
代理人
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地址
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