发明名称 WIRE BONDING APPARATUS
摘要 <p>PURPOSE:To facilitate change of kinds of components by mounting a spacer plate formed with a release hole of the component mounted on the rear face of a substrate on a heat block. CONSTITUTION:A preheating stage 2, a bonding stage 3 and an afterheating stage 4 are arranged along the conveying direction of a substrate 1. Heating blocks 5 each containing a heater 5a are respectively disposed on the stages 2, 3, 4 and spacer plates 6 each having an area substantially equal to its upper face are respectively detachably clamped by clamping means 5b such as bolts on the blocks 5. The thickness of the plate 6 is formed slightly larger than the height of a component 1a mounted on the substrate 1, and formed with a release hole 6a in which the component 1a mounted on the rear face of the substrate 1 is engaged. The blocks 5 of the stages 4, 3 are supported elevationally movably between the raised position of the same level as the block 5 and a lower position located lower than the raised position.</p>
申请公布号 JPH01241837(A) 申请公布日期 1989.09.26
申请号 JP19880070005 申请日期 1988.03.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAMOTO AKIHIRO;MATSUMURA SHINYA;MAKINO YUTAKA
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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